In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocessor system-on-chip (MPSoC) use in hard real-time systems. This article formalizes the t...
Thidapat Chantem, Robert P. Dick, Xiaobo Sharon Hu
Utilizing on-chip caches in embedded multiprocessorsystem-on-a-chip (MPSoC) based systems is critical from both performance and power perspectives. While most of the prior work th...
—Temperature has become an important issue in nowadays MPSoCs design due to the ever increasing power densities and huge energy consumption. This paper proposes a temperature-awa...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...