179 search results - page 7 / 36 » Temperature-aware global placement |
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Because of the increasing dominance of interconnect issues in advanced IC technology, placement has become a critical step in the IC design flow. To get accurate interconnect inf...
DAC
2000
ACM
14 years 8 months ago
2000
ACM
FPGA routing resources typically consist of segments of various lengths. Due to the segmented routing architectures, the traditional measure of wiring cost (wirelength, delay, con...
ICCAD
2003
IEEE
14 years 4 months ago
2003
IEEE
Multiple clock cycles are needed to cross the global interconnects for multi-gigahertz designs in nanometer technologies. For synchronous design, this requires the consideration o...
ASPDAC
2004
ACM
14 years 24 days ago
2004
ACM
— This paper describes a deterministic placement method for standard cells which minimizes total power consumption and leads to a smooth temperature distribution over the die. It...
ISPD
1997
ACM
13 years 11 months ago
1997
ACM
A linear wirelength objective more e ectively captures timing, congestion, and other global placement considerations than a squared wirelength objective. The GORDIAN-L cell placem...