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ICCD
2007
IEEE
225views Hardware» more  ICCD 2007»
14 years 6 months ago
Fine grain 3D integration for microarchitecture design through cube packing exploration
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
ICCD
2004
IEEE
137views Hardware» more  ICCD 2004»
14 years 6 months ago
Comparative Study of Strategies for Formal Verification of High-Level Processors
Compared are different methods for evaluation of formulas expressing microprocessor correctness in the logic of Equality with Uninterpreted Functions and Memories (EUFM) by transl...
Miroslav N. Velev
ICCAD
2006
IEEE
129views Hardware» more  ICCAD 2006»
14 years 6 months ago
Energy budgeting for battery-powered sensors with a known task schedule
Battery-powered wireless sensors are severely constrained by the amount of the available energy. A method for computing the energy budget per sensing task can be a valuable design...
Daler N. Rakhmatov
ICCAD
2005
IEEE
107views Hardware» more  ICCAD 2005»
14 years 6 months ago
Projection-based performance modeling for inter/intra-die variations
Large-scale process fluctuations in nano-scale IC technologies suggest applying high-order (e.g., quadratic) response surface models to capture the circuit performance variations....
Xin Li, Jiayong Le, Lawrence T. Pileggi, Andrzej J...
ICCAD
2001
IEEE
185views Hardware» more  ICCAD 2001»
14 years 6 months ago
Application-Driven Processor Design Exploration for Power-Performance Trade-off Analysis
1 - This paper presents an efficient design exploration environment for high-end core processors. The heart of the proposed design exploration framework is a two-level simulation e...
Diana Marculescu, Anoop Iyer