2343 search results - page 391 / 469 » The Locomotive Routing Problem |
137
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DAC
2007
ACM
16 years 4 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
128
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DAC
2002
ACM
16 years 4 months ago
2002
ACM
Reducing power dissipation is one of the most principle subjects in VLSI design today. Scaling causes subthreshold leakage currents to become a large component of total power diss...
136
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DAC
2002
ACM
16 years 4 months ago
2002
ACM
The ability to compute the parasitic inductance of the interconnect is critical to the timing verification of modern VLSI circuits. A challenging aspect of inductance extraction i...
104
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DAC
2004
ACM
16 years 4 months ago
2004
ACM
The negative effect of electromigration on signal and power line lifetime and functional reliability is an increasingly important problem for the physical design of integrated cir...
141
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DAC
2006
ACM
16 years 4 months ago
2006
ACM
Both technology mapping and circuit clustering have a large impact on FPGA designs in terms of circuit performance, area, and power dissipation. Existing FPGA design flows carry o...