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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 8 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICDM
2009
IEEE
160views Data Mining» more  ICDM 2009»
14 years 5 months ago
Fast Online Training of Ramp Loss Support Vector Machines
—A fast online algorithm OnlineSVMR for training Ramp-Loss Support Vector Machines (SVMR s) is proposed. It finds the optimal SVMR for t+1 training examples using SVMR built on t...
Zhuang Wang, Slobodan Vucetic
IROS
2009
IEEE
185views Robotics» more  IROS 2009»
14 years 5 months ago
Scalable and convergent multi-robot passive and active sensing
— A major barrier preventing the wide employment of mobile networks of robots in tasks such as exploration, mapping, surveillance, and environmental monitoring is the lack of efï...
Elias B. Kosmatopoulos, Lefteris Doitsidis, Konsta...
WINE
2009
Springer
178views Economy» more  WINE 2009»
14 years 5 months ago
The Geometry of Truthfulness
We study the geometrical shape of the partitions of the input space created by the allocation rule of a truthful mechanism for multi-unit auctions with multidimensional types and ...
Angelina Vidali
SMA
2009
ACM
223views Solid Modeling» more  SMA 2009»
14 years 5 months ago
Particle-based forecast mechanism for continuous collision detection in deformable environments
Collision detection in geometrically complex scenes is crucial in physical simulations and real time applications. Works based on spatial hierarchical structures have been propose...
Thomas Jund, David Cazier, Jean-François Du...