98 search results - page 6 / 20 » The scaling of interconnect buffer needs |
INTEGRATION
2008
13 years 8 months ago
2008
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...
INTEGRATION
2006
13 years 8 months ago
2006
In the context of physical synthesis, large-scale standard-cell placement algorithms must facilitate incremental changes to layout, both local and global. In particular, flexible ...
ICCAD
2001
IEEE
14 years 5 months ago
2001
IEEE
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
ISQED
2006
IEEE
14 years 2 months ago
2006
IEEE
Process variation has become a major concern in the design of many nanometer circuits, including interconnect pipelines. This paper develops closed-form models to predict the dela...
DAC
2009
ACM
14 years 9 months ago
2009
ACM
Post-silicon validation has become an essential step in the design flow of today's complex integrated circuits. One effective technique that provides real-time visibility to ...