104 search results - page 6 / 21 » Thermal Characterization and Thermal Management in Processor... |
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
GLVLSI
2010
IEEE
14 years 28 days ago
2010
IEEE
Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. The goal of thermal mana...
CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
DATE
2010
IEEE
14 years 28 days ago
2010
IEEE
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
RTCSA
2009
IEEE
14 years 2 months ago
2009
IEEE
Distributed real-time embedded systems have stringent requirements for key performance properties, such as endto-end timeliness and reliability, in order to operate properly. In r...