68 search results - page 6 / 14 » Thermal and Power Integrity Based Power Ground Networks Opti... |
DAC
2008
ACM
14 years 8 months ago
2008
ACM
In the design of complex power distribution networks (PDN) with multiple power islands, it is required that the PDN represents a low impedance as seen by the digital modules. This...
TWC
2010
13 years 2 months ago
2010
This paper studies the problem of finding a minimum-length schedule of a power-controlled wireless network subject to traffic demands and SINR (signal-to-interferenceplus-noise rat...
DAC
2011
ACM
12 years 7 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
TCOM
2010
13 years 5 months ago
2010
Dynamic spectrum access (DSA) is an integral part of cognitive radio technology aiming at efficient management of the available power and bandwidth resources. The present paper d...
ICCAD
2007
IEEE
14 years 4 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...