50 search results - page 8 / 10 » Thermal modeling and analysis of 3D multi-processor chips |
DATE
2006
IEEE
14 years 1 months ago
2006
IEEE
This paper derives the multi-layer heat conduction Green’s function, by integrating the eigen-expansion technique and the classic transmission line theories, and presents a loga...
CVPR
2007
IEEE
14 years 9 months ago
2007
IEEE
The paper presents a fusion-tracker and pedestrian classifier for color and thermal cameras. The tracker builds a background model as a multi-modal distribution of colors and temp...
DAC
2010
ACM
13 years 11 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
CASES
2007
ACM
13 years 11 months ago
2007
ACM
We derive analytically, the performance optimal throttling curve for a processor under thermal constraints for a given task sequence. We found that keeping the chip temperature co...
CODES
2009
IEEE
14 years 3 days ago
2009
IEEE
Performance estimation of Multi-Processor System-On-Chip (MPa high abstraction level is required in order to perform early architecture exploration and accurate design validations...