1476 search results - page 261 / 296 » Three-dimensional integrated circuits |
SPAA
2000
ACM
14 years 1 months ago
2000
ACM
Modern VLSI processing supports a two-dimensional surface for active devices along with multiple stacked layers of interconnect. With the advent of planarization, the number of la...
DAC
1995
ACM
14 years 1 months ago
1995
ACM
High-level synthesis (HLS) has been successfully targeted towards the digital signal processing (DSP) domain. Both application-speci c integrated circuits (ASICs) and application-...
DAC
2010
ACM
14 years 1 months ago
2010
ACM
Fault simulation is essential in test generation, design for test and reliability assessment of integrated circuits. Reliability analysis and the simulation of self-test structure...
GLVLSI
2010
IEEE
14 years 3 days ago
2010
IEEE
This paper describes a physics-based semi-analytical model for Schottky-barrier carbon nanotube (CNT) and graphene nanoribbon (GNR) transistors. The model includes the treatment o...
ASPDAC
2005
ACM
14 years 2 days ago
2005
ACM
Abstract— Regular structures are present in many types of circuits. If this structure can be identified and utilized, performance can be improved dramatically. In this paper, we...