1476 search results - page 6 / 296 » Three-dimensional integrated circuits |
DAC
2007
ACM
13 years 11 months ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
ISCAS
2007
IEEE
14 years 2 months ago
2007
IEEE
— We present a method for fast analysis of signal and power integrity based on a recently developed multilayered finite difference method (M-FDM). In order to accurately model m...
ICCAD
2004
IEEE
14 years 4 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
GLVLSI
2009
IEEE
14 years 2 months ago
2009
IEEE
A synthetic noise function is a key component of most computer graphics rendering systems. This pseudo-random noise function is used to create a wide variety of natural looking te...
SIAMSC
2010
13 years 6 months ago
2010
We develop an adaptive finite element method for solving the eddy current model with voltage excitations for complicated three dimensional structures. The mathematical model is ba...