166 search results - page 5 / 34 » Through Silicon Vias as Enablers for 3D Systems |
IJRR
2010
13 years 5 months ago
2010
This paper investigates sequential robotic microassembly for the construction of 3D micro-electro-mechanical systems (MEMS) structures using a 3D visual servoing approach. The pre...
GLVLSI
2009
IEEE
14 years 2 months ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
ETS
2010
IEEE
13 years 8 months ago
2010
IEEE
Testing of 3D stacked ICs (SICs) is becoming increasingly important in the semiconductor industry. In this paper, we address the problem of test architecture optimization for 3D s...
TOG
2012
11 years 10 months ago
2012
Large collections of 3D models from the same object class (e.g., chairs, cars, animals) are now commonly available via many public repositories, but exploring the range of shape v...
DAC
2011
ACM
12 years 7 months ago
2011
ACM
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...