A number of industry trends are shaping the requirements for IC and electronic equipment design. The density and complexity of circuit technologies have increased to a point where...
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
In embedded cryptosystems, sensitive information can leak via timing, power, and electromagnetic channels. We introduce a novel power-smart system-on-chip architecture that provid...
Radu Muresan, Haleh Vahedi, Y. Zhanrong, Stefano G...
Typically,cell parameterssuch as the pin-to-pinintrinsicdelays, load-dependentcoe cients,andinputpin capacitanceshavedifferent values for rising and falling signals. The performan...
We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...