Current developments show that tomorrow’s information systems and applications will no longer be based on monolithic architectures that encompass all the functionality. Rather, t...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Abstract Complex systems call for a hierarchical description. Analogously, the engineering of non-trivial MASs (multiagent systems) requires principles and mechanisms for a multi-l...
Ambra Molesini, Andrea Omicini, Alessandro Ricci, ...
Abstract. The need for effective testing techniques for architectural level descriptions is widely recognised. However, due to the variety of domain-specific architectural descript...
Body-area sensor network or BAN-based health monitoring is increasingly becoming a popular alternative to traditional wired bio-monitoring techniques. However, most biomonitoring ...
Yun Liang, Lei Ju, Samarjit Chakraborty, Tulika Mi...