Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
—Integrated circuit (IC) design for a wireless BCI system is put forward in this paper. The system is composed of an electrode, a stimulator, antennas, and an integrated circuit ...
The new standard DRM for digital radio broadcast in AM band requires integrated devices for radio receivers at low cost and very low power consumption. A chipset is currently desi...
Michel Sarlotte, Bernard Candaele, J. Quevremont, ...
Currently, since many SoCs include heterogeneous components such as CPUs, DSPs, ASICs, memories, buses, etc., system integration becomes a major step in the design flow. To enable...
Ahmed Amine Jerraya, Sungjoo Yoo, Aimen Bouchhima,...
Software-based, fine-grain control flow integrity (CFI) validation technique has been proposed to enforce control flow integrity of program execution. By validating every indirect...