Chips manufactured in 90 nm technology have shown large parametric variations, and a worsening trend is predicted. These parametric variations make circuit optimization difficult ...
Jinjun Xiong, Vladimir Zolotov, Natesan Venkateswa...
Several studies of speculative execution based on values have reported promising performance potential. However, virtually all microarchitectures in these studies were described i...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
This paper proposes 2G, a flexible and energy-efficient data collection protocol for sensor networks for increasing network lifetime. To this end, it integrates self-organizing d...
Neeraj Rajgure, Eric Platon, Cristian Borcea, Shin...
—At present there is a strong worldwide push toward bringing fiber closer to individual homes and businesses. Another evolutionary step is the cost-effective all-optical integra...
Lehan Meng, Chadi Assi, Martin Maier, Ahmad R. Dha...