Yield and variability are becoming detractors for successful design in sub-90-nm process technologies. We consider the fundamental lithography and process issues that are driving ...
— Variability in the chip design process has been relatively increasing with technology scaling to smaller dimensions. Using worst case analysis for circuit optimization severely...
We present a general rule induction algorithm based on sequential covering, suitable for variable consistency rough set approaches. This algorithm, called VC-DomLEM, can be used f...
Jerzy Blaszczynski, Roman Slowinski, Marcin Szelag
Variations in the semiconductor fabrication process results in variability in parameters between transistors on the same die, a problem exacerbated by lithographic scaling. The re...
Most tandem mass spectrum identification algorithms use information only from the final spectrum, ignoring precursor information such as peptide retention time (RT). Efforts to exp...
Aaron A. Klammer, Xianhua Yi, Michael J. MacCoss, ...