Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
ct Digital's NVAX high-performance microprocessor has a complex logical design. A rigorous simulation-based verification effort was undertaken to ensure that there were no log...
We present the design exploration of a System-on-Chip architecture dedicated to the implementation of the HIPERLAN/2 communication protocol. The task was accomplished by means of ...
Francesco Menichelli, Mauro Olivieri, Luca Benini,...
Functional validation of modern microprocessors is an important and complex problem. One of the problems in functional validation is the generation of test cases that has higher p...
Deepak Mathaikutty, Sandeep K. Shukla, Sreekumar V...