549 search results - page 43 / 110 » Weaving a Computing Fabric |
ICPP
2008
IEEE
14 years 4 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
DATE
2010
IEEE
14 years 3 months ago
2010
IEEE
Abstract—Future microprocessors increasingly rely on an unreliable CMOS fabric due to aggressive scaling of voltage and frequency, and shrinking design margins. Fortunately, many...
VISUALIZATION
2000
IEEE
14 years 2 months ago
2000
IEEE
Visualization techniques enable scientists to interactively explore 3D data sets, segmenting and cutting them to reveal inner structure. While powerful, these techniques suffer fr...
DAC
1994
ACM
14 years 2 months ago
1994
ACM
Today's high-performance single-chip CMOS microprocessors are the most complex and challenging chip designs ever implemented. To stay on the leading edge, Digital's micro...
FPL
2006
Springer
14 years 1 months ago
2006
Springer
FPGAs have reached densities that can implement floatingpoint applications, but floating-point operations still require a large amount of FPGA resources. One major component of IE...