Chip Multiprocessors (CMPs) allow different applications to concurrently execute on a single chip. When applications with differing demands for memory compete for a shared cache, ...
Aamer Jaleel, William Hasenplaugh, Moinuddin K. Qu...
Though all of the current main-stream OSs have supported superpage to some extent, most of them need runtime information provided by applications, simulator or other tools. Transp...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
The trends in enterprise IT toward service-oriented computing, server consolidation, and virtual computing point to a future in which workloads are becoming increasingly diverse i...
We present AutoDVS, a dynamic voltage scaling (DVS) system for hand-held computers. Unlike extant DVS systems, AutoDVS distinguishes common, course-grain, program behavior and cou...