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106
Voted
ASPDAC
2009
ACM
15 years 10 months ago
2009
ACM
— A quadratic slope compensation scheme for a current-mode DC-DC converter to obtain stable frequency characteristics without depending on the input and output voltages is propos...
115
Voted
ASPDAC
2009
ACM
15 years 1 months ago
2009
ACM
We have developed a new 3-dimensional stacking technology using wafer-to-wafer stacked method and evaluated the connectivity between TSV and micro-bump. The prototype 3-layer stac...
98
Voted
ASPDAC
2009
ACM
15 years 10 months ago
2009
ACM
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
133
Voted
ASPDAC
2009
ACM
15 years 10 months ago
2009
ACM
Abstract— In the context of a design space exploration framework for supporting the platform-based design approach, we address the problem of robustness with respect to manufactu...
128
Voted
ASPDAC
2009
ACM
15 years 7 months ago
2009
ACM
The number of vias generated during the global routing stage is a critical factor for the yield of final circuits. However, most global routers only approach the problem by chargin...