3DIC
2009
IEEE
14 years 7 months ago
2009
IEEE
- This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of ...
3DIC
2009
IEEE
14 years 7 months ago
2009
IEEE
—The physical performance of a 3-Dimensional Network-on-Chip (NoC) mesh architecture employing Through Silicon Vias (TSV) for vertical connectivity is investigated with a cycle-a...