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Dramatic progress has been made in algorithms for placement and routing over the last 5 years, with improvements in both speed and quality. Combining placement and routing into a ...
Jarrod A. Roy, Natarajan Viswanathan, Gi-Joon Nam,...
- Redundant via insertion is a good solution to reduce the yield loss by via failure. However, the existing methods are all post-layout optimizations that insert redundant via afte...
Gang Xu, Li-Da Huang, David Z. Pan, Martin D. F. W...
We present results which show that a separate global and detailed routing strategy can be competitive with a combined routing process. Under restricted architectural assumptions, ...
Guy G. Lemieux, Stephen Dean Brown, Daniel Vranesi...
— This article describes an algorithm for curvilinear detailed routing. We significantly improved the average time performance of Gao’s algorithm by resolving its bottleneck r...
— In ultra-deep submicron technology, crosstalk noise is so severe that crosstalk avoidance merely in detailed routing is not adequate and it has to be considered in earlier desi...
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...