Timing budgeting under process variations is an important step in a statistical optimization flow. We propose a novel formulation of the problem where budgets are statistical ins...
— In this paper, we present the first work on the Steiner routing for 3D stacked ICs. In the 3D Steiner routing problem, the pins are located in multiple device layers, which ma...
—We present an implementation of an algorithm for constructing provably fast circuits for a class of Boolean functions with input signals that have individual starting times. We ...
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
Modern processing technologies offer a number of types of devices such as high-VT , low-VT , thick-oxide, etc. in addition to the nominal transistor in order to meet system perfor...
Jintae Kim, Ritesh Jhaveri, Jason Woo, Chih-Kong K...
—In this paper, we introduce a novel reconfigurable architecture, named 3D nFPGA, which utilizes 3D integration techniques and new nanoscale materials synergistically. The propos...
— The paper addresses the problem of performance optimization for a set of periodic tasks with discrete voltage/frequency states under thermal constraints. We prove that the prob...
Functional dependency is concerned with rewriting a Boolean function f as a function h over a set of base functions {g1, …, gn}, i.e. f = h(g1, …, gn). It plays an important r...
Chih-Chun Lee, Jie-Hong Roland Jiang, Chung-Yang H...
This paper studies microprocessor floorplanning considering thermal and throughput optimization. We first develop a stochastic heat diffusion model taking into account the appl...