ISPD
1998
ACM
14 years 4 months ago
1998
ACM
We describe a novel iterationless approach for computing the effective capacitance of an interconnect load at a driving gate output. Our new approach is considerably faster than p...
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
With the recent advent of deep sub-micron technology and new packaging schemes such as Multi-Chip Modules(MCMs), integrated circuit components are often not rectangular. Most exis...
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
In this paper, we present a performance-driven softmacro clustering and placement method which preserves HDL design hierarchy to guide the soft-macro placement process. We also pr...
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
We propose a simple, isometry invariant pattern matching algorithm for an effective data reduction useful in layout-related data processing of very complex IC designs. The repeata...
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
As chip size and design density increase, coupling effects (crosstalk) between signal wires become increasingly critical to on–chip timing and even functionality. A method is pr...
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
Performance-driven physical design is becoming more important as advances in IC technologies enable gigahertz operating frequencies. These same IC technologies, however, exhibit d...
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
This paper proposes a placement method for a mixed set of hard, soft, and pre-placed modules, based on a placement topology representation called sequence-pair. Under one sequence...
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
In this paper, we formulate the problem of topology constrained rectilinear block packing in layout reuse. A speci c class of rectilinear shaped blocks, ordered convex rectilinear...
ISPD
1998
ACM
14 years 4 months ago
1998
ACM
In very deep-submicron VLSI, certain manufacturing steps – notably optical exposure, resist development and etch, chemical vapor deposition and chemical-mechanical polishing (CM...