Sciweavers

DAC
2011
ACM
13 years 13 days ago
Characterizing within-die and die-to-die delay variations introduced by process variations and SOI history effect
Variations in delay caused by within-die and die-to-die process variations and SOI history effect increase timing margins and reduce performance. In order to develop mitigation te...
Jim Aarestad, Charles Lamech, Jim Plusquellic, Dhr...
ISCAS
2003
IEEE
110views Hardware» more  ISCAS 2003»
14 years 6 months ago
A modular test structure for CMOS mismatch characterization
In this work a new test structure for mismatch characterization of CMOS technologies is presented. The test structure is modular, with a reduced area and it can be inserted in the...
Massimo Conti, Paolo Crippa, Francesco Fedecostunt...