DATE
2006
IEEE
14 years 4 months ago
2006
IEEE
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
ICCAD
2003
IEEE
14 years 7 months ago
2003
IEEE
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal ...
ICCD
2005
IEEE
14 years 7 months ago
2005
IEEE
Thermal management in microprocessors has become a major design challenge in recent years. Thermal monitoring through hardware sensors is important, and these sensors must be care...