157
Voted
DAC
2006
ACM
16 years 7 months ago
2006
ACM
In this paper we present a generic interconnect fabric for transaction level modelling tackeling three major aspects. First, a review of the bus and IO structures that we have ana...
144
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Subthreshold circuit designs have been demonstrated to be a successful alternative when ultra-low power consumption is paramount. However, the characteristics of MOS transistors i...
165
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Energy harvesting offers a promising alternative to solve the sustainability limitations arising from battery size constraints in sensor networks. Several considerations in using ...
153
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
This paper describes an ultra low power active RFID tag and its automated design flow. RFID primitives to be supported by the tag are enumerated with RFID macros and the behavior ...
190
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
ing models and HW-SW Interfaces Abstraction for Multi-Processor SoC Ahmed A. Jerraya TIMA Laboratory 46 Ave Felix Viallet 38031 Grenoble CEDEX, France +33476574759 Ahmed.Jerraya@im...
145
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Application-specific instruction-set extensions (custom instructions) help embedded processors achieve higher performance. Most custom instructions offering significant performanc...
181
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
The increasing use of Multiprocessor Systems-on-Chip (MPSoCs) for high performance demands of embedded applications results in high power dissipation. The memory subsystem is a la...
167
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...