10 search results - page 1 / 2 » Addressing thermal and power delivery bottlenecks in 3D circ... |
ASPDAC
2009
ACM
14 years 2 months ago
2009
ACM
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
DAC
2009
ACM
14 years 8 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
ICCAD
2004
IEEE
14 years 4 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...