1398 search results - page 166 / 280 » Application-Specific Integrated Circuits |
TCAD
2008
13 years 8 months ago
2008
Starting at the 65-nm node, stress engineering to improve the performance of transistors has been a major industry focus. An intrinsic stress source--shallow trench isolation (STI)...
TVLSI
2008
13 years 7 months ago
2008
As CMOS technology scales deeper into the nanometer regime, factors such as leakage power and chip temperature emerge as critically important concerns for high-performance VLSI des...
VLSID
2010
IEEE
13 years 6 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Process and environmental variations continue to present significant challenges to designers of high-performance integrated circuits. In the past few years, while much research has...
ATS
2010
IEEE
13 years 4 months ago
2010
IEEE
Systems with many integrated circuits (ICs), often of the same type, are increasingly common to meet the constant performance demand. However, systems in recent semiconductor techn...