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ISCA
2010
IEEE
210views Hardware» more  ISCA 2010»
14 years 24 days ago
An intra-chip free-space optical interconnect
Continued device scaling enables microprocessors and other systems-on-chip (SoCs) to increase their performance, functionality, and hence, complexity. Simultaneously, relentless s...
Jing Xue, Alok Garg, Berkehan Ciftcioglu, Jianyun ...
ASAP
2002
IEEE
105views Hardware» more  ASAP 2002»
14 years 20 days ago
Implications of Programmable General Purpose Processors for Compression/Encryption Applications
With the growth of the Internet and mobile communication industry, multimedia applications form a dominant computer workload. Media workloads are typically executed on Application...
Byeong Kil Lee, Lizy Kurian John
VLSID
1998
IEEE
116views VLSI» more  VLSID 1998»
13 years 12 months ago
Synthesis of Testable RTL Designs
With several commercial tools becoming available, the high-level synthesis of applicationspeci c integrated circuits is nding wide spread acceptance in VLSI industry today. Existi...
C. P. Ravikumar, Sumit Gupta, Akshay Jajoo
ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
13 years 11 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
ASPDAC
2007
ACM
123views Hardware» more  ASPDAC 2007»
13 years 11 months ago
Coupling-aware Dummy Metal Insertion for Lithography
As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RETs) are needed to correctly manufacture a chip...
Liang Deng, Martin D. F. Wong, Kai-Yuan Chao, Hua ...