In this paper, a method for the automatic sizing of analog integrated circuits is presented. Basic sizing rules, representing circuit knowledge, are set up before the sizing and a...
Robert Schwencker, Josef Eckmueller, Helmut E. Gra...
Core-based system-on-chips (SoCs) fabricated on threedimensional (3D) technology are emerging for better integration capabilities. Effective test architecture design and optimizat...
As integrated circuits are migrated to more advanced technologies, it has become clear that crosstalk is an important physical phenomenon that must be taken into account. Crosstal...
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
This panel discusses the following topics. With the ongoing trend towards more and more digitization in applications ranging from multimedia to telecommunications, there is a big ...
Shekhar Y. Borkar, Robert W. Brodersen, Jue-Hsien ...