1398 search results - page 97 / 280 » Application-Specific Integrated Circuits |
ISPD
2005
ACM
14 years 1 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
ICCAD
2003
IEEE
14 years 1 months ago
2003
IEEE
This paper presents several important enhancements to the recently published multilevel placement package mPL [12]. The improvements include (i) unconstrained quadratic relaxation...
FPGA
2003
ACM
14 years 1 months ago
2003
ACM
As integrated circuits become more and more complex, the ability to make post-fabrication changes will become more and more attractive. This ability can be realized using programm...
ICCAD
2003
IEEE
14 years 5 months ago
2003
IEEE
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal ...
ICCAD
2001
IEEE
14 years 5 months ago
2001
IEEE
We present a methodology for generating black-box timing models for full-custom transistor-level CMOS circuits. Our approach utilizes transistor-level ternary symbolic timing simu...