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ICCAD
2002
IEEE
113views Hardware» more  ICCAD 2002»
14 years 4 months ago
Interconnect-aware high-level synthesis for low power
Abstract—Interconnects (wires, buffers, clock distribution networks, multiplexers and busses) consume a significant fraction of total circuit power. In this work, we demonstrat...
Lin Zhong, Niraj K. Jha
DAC
2003
ACM
14 years 8 months ago
Multilevel global placement with retiming
Multiple clock cycles are needed to cross the global interconnects for multi-gigahertz designs in nanometer technologies. For synchronous designs, this requires retiming and pipel...
Jason Cong, Xin Yuan
ISCA
2008
IEEE
188views Hardware» more  ISCA 2008»
14 years 2 months ago
MIRA: A Multi-layered On-Chip Interconnect Router Architecture
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
Dongkook Park, Soumya Eachempati, Reetuparna Das, ...
ISQED
2006
IEEE
107views Hardware» more  ISQED 2006»
14 years 1 months ago
On Optimizing Scan Testing Power and Routing Cost in Scan Chain Design
— With advanced VLSI manufacturing technology in deep submicron (DSM) regime, we can integrate entire electronic systems on a single chip (SoC). Due to the complexity in SoC desi...
Li-Chung Hsu, Hung-Ming Chen
ISCA
2010
IEEE
305views Hardware» more  ISCA 2010»
14 years 22 days ago
Rethinking DRAM design and organization for energy-constrained multi-cores
DRAM vendors have traditionally optimized the cost-perbit metric, often making design decisions that incur energy penalties. A prime example is the overfetch feature in DRAM, wher...
Aniruddha N. Udipi, Naveen Muralimanohar, Niladris...