Chips manufactured in 90 nm technology have shown large parametric variations, and a worsening trend is predicted. These parametric variations make circuit optimization difficult ...
Jinjun Xiong, Vladimir Zolotov, Natesan Venkateswa...
Achieving design closure is one of the biggest headaches for modern VLSI designers. This problem is exacerbated by high-level design automation tools that ignore increasingly impo...
Zhenyu (Peter) Gu, Jia Wang, Robert P. Dick, Hai Z...
This paper presents innovative research into the use of videogame environments within architectural design studios. In this context, 3D videogame environments encourage new unders...
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propo...
Wei Huang, Mircea R. Stan, Kevin Skadron, Karthik ...
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...