3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
Jonathan Valamehr, Ted Huffmire, Cynthia E. Irvine...
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
Until recently, a steadily rising clock rate and other uniprocessor microarchitectural improvements could be relied upon to consistently deliver increasing performance for a wide ...
Guilherme Ottoni, Ram Rangan, Adam Stoler, David I...
With increasing chip densities, future microprocessor designs have the opportunity to integrate many of the traditional systemlevel modules onto the same chip as the processor. So...
As the number of integrated IP cores in the current System-on-Chips (SoCs) keeps increasing, communication requirements among cores can not be sufficiently satisfied using either ...
Jun Ho Bahn, Seung Eun Lee, Yoon Seok Yang, Jungso...