Increases in instruction level parallelism are needed to exploit the potential parallelism available in future wide issue architectures. Predicated execution is an architectural m...
Lori Carter, Beth Simon, Brad Calder, Larry Carter...
The ability to control the variations in IC fabrication process is rapidly diminishing as feature sizes continue towards the sub-100 nm regime. As a result, there is an increasing...
Sreeja Raj, Sarma B. K. Vrudhula, Janet Meiling Wa...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Abstract— Design variability due to within-die and die-todie process variations has the potential to significantly reduce the maximum operating frequency and the effective yield...
- Wireless sensor networks have been widely used in many fields with the developments of the related techniques. But there are many problems in traditional single sink sensor netwo...
Min Meng, Hui Xu, Xiaoling Wu, Brian J. d'Auriol, ...