189 search results - page 6 / 38 » Design and implementation of WIRE Diameter |
ICCD
2005
IEEE
14 years 6 months ago
2005
IEEE
3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication invo...
ICCAD
1994
IEEE
14 years 1 months ago
1994
IEEE
In this paper, we study the simultaneousdriver and wire sizing (SDWS) problem under two objective functions: (i) delay minimization only, or (ii) combined delay and power dissipat...
LCN
2008
IEEE
14 years 4 months ago
2008
IEEE
—During the last decades, the Internet has steadily developed into a mass medium. The target group radically changed compared to, e.g., the 90s. Because virtually everyone has ac...
PEPM
2009
ACM
15 years 10 months ago
2009
ACM
The Verilog hardware description language has padding semantics that allow designers to write descriptions where wires of different bit widths can be interconnected. However, many ...
ICCD
1991
IEEE
14 years 1 months ago
1991
IEEE
This article proposes a completion-detection method for efficiently implementing Boolean functions as self-timed logic structures. Current-Sensing Completion Detection, CSCD, allow...