26 search results - page 2 / 6 » Distributing the Frontend for Temperature Reduction |
DAC
2008
ACM
14 years 8 months ago
2008
ACM
Temperature hot-spots have been known to cause severe reliability problems and to significantly increase leakage power. The register file has been previously shown to exhibit the ...
ISLPED
2003
ACM
14 years 28 days ago
2003
ACM
Power dissipation is unevenly distributed in modern microprocessors leading to localized hot spots with significantly greater die temperature than surrounding cooler regions. Exc...
ICCD
2005
IEEE
14 years 4 months ago
2005
IEEE
As technology scales, power consumption and thermal effects have become challenges for system-on-chip designers. The rising on-chip temperatures can have negative impacts on SoC p...
DATE
2005
IEEE
14 years 1 months ago
2005
IEEE
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling a...
ASPDAC
2004
ACM
14 years 1 months ago
2004
ACM
— This paper describes a deterministic placement method for standard cells which minimizes total power consumption and leads to a smooth temperature distribution over the die. It...