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DATE
2009
IEEE
154views Hardware» more  DATE 2009»
14 years 4 months ago
Reliability aware through silicon via planning for 3D stacked ICs
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
ISQED
2006
IEEE
259views Hardware» more  ISQED 2006»
14 years 3 months ago
Impact of NBTI on SRAM Read Stability and Design for Reliability
— Negative Bias Temperature Instability (NBTI) has the potential to become one of the main show-stoppers of circuit reliability in nanometer scale devices due to its deleterious ...
Sanjay V. Kumar, Chris H. Kim, Sachin S. Sapatneka...
ISQED
2009
IEEE
126views Hardware» more  ISQED 2009»
14 years 4 months ago
Robust differential asynchronous nanoelectronic circuits
Abstract — Nanoelectronic design faces unprecedented reliability challenges and must achieve noise immunity and delay insensitiveness in the presence of prevalent defects and sig...
Bao Liu
GLVLSI
2010
IEEE
310views VLSI» more  GLVLSI 2010»
14 years 2 months ago
Graphene tunneling FET and its applications in low-power circuit design
Graphene nanoribbon tunneling FETs (GNR TFETs) are promising devices for post-CMOS low-power applications because of the low subthreshold swing, high Ion/Ioff, and potential for l...
Xuebei Yang, Jyotsna Chauhan, Jing Guo, Kartik Moh...
GECCO
2007
Springer
211views Optimization» more  GECCO 2007»
14 years 4 months ago
Multi-objective univariate marginal distribution optimisation of mixed analogue-digital signal circuits
Design for specific customer service plays a crucial role for the majority of the market in modern electronics. However, adaptability to an individual customer results in increasi...
Lyudmila Zinchenko, Matthias Radecker, Fabio Bisog...