As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
Rectangle (square) packing problems involve packing all squares with sizes 1 × 1 to n × n into the minimum area enclosing rectangle (respectively, square). Rectangle packing is a...
The Electrical Engineering Summer Academy for Pre-College Students was held at the University of Tulsa from June 11th through June 15th , 2007. Of the 20 students accepted, 19 par...
Peter LoPresti, Theodore W. Manikas, Jeff Kohlbeck
LightUp is a constructionist platform to teach novices about electronics, and also a low-cost rapid-prototyping platform for more advanced users. The LightUp kit contains many bas...
Zain Asgar, Joshua Chan, Chang Liu, Paulo Blikstei...
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...