In this paper we propose a novel analog design optimization methodology to address two key aspects of top-down system-level design: (1) how to optimally compare and select analog ...
Xin Li, Jian Wang, Lawrence T. Pileggi, Tun-Shih C...
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
The efficient implementation of multimedia algorithms, for the ever increasing complexity of the specifications and the emergence of the new generation of processing platforms c...
Christophe Lucarz, Marco Mattavelli, Julien Dubois
With the scaling of technology and higher requirements on performance and functionality, power dissipation is becoming one of the major design considerations in the development of...
Jia Yu, Wei Wu, Xi Chen, Harry Hsieh, Jun Yang 000...
straction SUDEEP PASRICHA and NIKIL DUTT University of California, Irvine and MOHAMED BEN-ROMDHANE Newport Media Inc. Currently, system-on-chip (SoC) designs are becoming increasin...