238 search results - page 12 / 48 » Hierarchical Interconnect Circuit Models |
ISQED
2006
IEEE
14 years 1 months ago
2006
IEEE
Process variation has become a major concern in the design of many nanometer circuits, including interconnect pipelines. This paper develops closed-form models to predict the dela...
ICCAD
1997
IEEE
13 years 11 months ago
1997
IEEE
Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends...
ICCAD
2002
IEEE
14 years 4 months ago
2002
IEEE
In this paper, we present a novel wire duplication-based interconnect modeling technique. The proposed modeling technique exploits the sparsity of the L 1 matrix, where L is the ...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
ICCAD
2004
IEEE
14 years 4 months ago
2004
IEEE
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...