215 search results - page 29 / 43 » Integrating Abduction and Induction |
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
ISCAS
2008
IEEE
14 years 2 months ago
2008
IEEE
—We present experimental results from an integrated circuit designed for wireless neural recording applications. The chip, which was fabricated in a 0.6-µm 2P3M BiCMOS process, ...
ICCD
2001
IEEE
14 years 4 months ago
2001
IEEE
The formiila-based I<,JJ model is a figiire of merit for the inductive coirpling, and has been used to solve the simrrltaneoris shield insertion and net ordering (SINO) and sim...
DATE
2008
IEEE
14 years 2 months ago
2008
IEEE
— The inductance and coupling effects in interconnects and non-linear receiver loads has resulted in complex input signals and output loads for gates in the modern deep submicron...
PKDD
2001
Springer
14 years 2 days ago
2001
Springer
Large amount of available information does not necessarily imply that induction algorithms must use all this information. Samples often provide the same accuracy with less computat...