Many practical routing problems such as BGA, PGA, pin redistribution and test xture routing involve routing with interchangeable pins. These routing problems, especiallypackage la...
In this paper, we study the net and pin distribution problem for global routing targeting three dimensional packaging layout via System-on-Package (SOP). The routing environment f...
Abstract. We present a generic package for resource constrained network optimization problems. We illustrate the flexibility and the use of our package by solving four applications...
We propose a new VLSI layout methodology which addresses the main problems faced in Deep Sub-Micron (DSM) integrated circuit design. Our layout "fabric" scheme eliminate...
Sunil P. Khatri, Amit Mehrotra, Robert K. Brayton,...
—The routing environment for the new emerging mixed-signal System-on-Package (SOP) technology is more advanced than that of the conventional PCB or MCM technology – pins are lo...