25 search results - page 4 / 5 » Interconnect capacitance extraction for system LCD circuits |
GLVLSI
2008
IEEE
14 years 2 months ago
2008
IEEE
In this paper, we propose a novel statistical capacitance extraction method for interconnects considering process variations. The new method, called statCap, is based on the spect...
DATE
2003
IEEE
14 years 29 days ago
2003
IEEE
Interconnect delay dominates system delay in modern circuits, and with reduced feature sizes, coupling capacitance and signal crosstalk have become significant issues. By spacing...
ICCD
2005
IEEE
14 years 4 months ago
2005
IEEE
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
GLVLSI
2009
IEEE
13 years 5 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...