17 search results - page 3 / 4 » Interconnect opportunities for gigascale integration |
ISCA
2010
IEEE
14 years 18 days ago
2010
IEEE
Continued device scaling enables microprocessors and other systems-on-chip (SoCs) to increase their performance, functionality, and hence, complexity. Simultaneously, relentless s...
IPPS
2006
IEEE
14 years 1 months ago
2006
IEEE
The designs of high-performance processor architectures are moving toward the integration of a large number of multiple processing cores on a single chip. The IBM Cyclops-64 (C64)...
FPGA
2003
ACM
14 years 21 days ago
2003
ACM
How does multilevel metalization impact the design of FPGA interconnect? The availability of a growing number of metal layers presents the opportunity to use wiring in the thirddi...
MICRO
2008
IEEE
14 years 1 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
ICWS
2009
IEEE
14 years 4 months ago
2009
IEEE
Advances in the areas of embedded systems, computing, and networking are leading to an infrastructure composed of millions of heterogeneous devices. These devices will not simply ...