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» Introspective 3D chips
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SAC
2006
ACM
14 years 1 months ago
Hardware/software 2D-3D backprojection on a SoPC platform
The reduction of image reconstruction time is needed to spread the use of PET for research and routine clinical practice. In this purpose, this article presents a hardware/softwar...
Nicolas Gac, Stéphane Mancini, Michel Desvi...
ASPDAC
2009
ACM
159views Hardware» more  ASPDAC 2009»
14 years 8 days ago
Congestion-aware power grid optimization for 3D circuits using MIM and CMOS decoupling capacitors
— In three-dimensional (3D) chips, the amount of supply current per package pin is significantly more than in two-dimensional (2D) designs. Therefore, the power supply noise pro...
Pingqiang Zhou, Karthikk Sridharan, Sachin S. Sapa...
DATE
2008
IEEE
142views Hardware» more  DATE 2008»
14 years 2 months ago
Developing Mesochronous Synchronizers to Enable 3D NoCs
The NETWORK-ON-CHIP (NOC) interconnection paradigm has been gaining momentum thanks to its flexibility, scalability and suitability to deep submicron technology processes. The ne...
Igor Loi, Federico Angiolini, Luca Benini
DFT
2006
IEEE
143views VLSI» more  DFT 2006»
14 years 1 months ago
Defect Tolerant and Energy Economized DSP Plane of a 3-D Heterogeneous SoC
This paper1 discusses a defect tolerant and energy economized computing array for the DSP plane of a 3-D Heterogeneous System on a Chip. We present the J-platform, which employs c...
Vijay K. Jain, Glenn H. Chapman
SIGGRAPH
1993
ACM
13 years 11 months ago
Leo: a system for cost effective 3D shaded graphics
A physically compact, low cost, high performance 3D graphics accelerator is presented. It supports shaded rendering of triangles and antialiased lines into a double-buffered 24-bi...
Michael F. Deering, Scott R. Nelson