108 search results - page 14 / 22 » Introspective 3D chips |
3DIC
2009
IEEE
14 years 3 days ago
2009
IEEE
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
ISCA
2008
IEEE
14 years 3 months ago
2008
IEEE
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
HIPEAC
2010
Springer
14 years 5 months ago
2010
Springer
As CMOS feature sizes venture deep into the nanometer regime, wearout mechanisms including negative-bias temperature instability and timedependent dielectric breakdown can severely...
ASPDAC
2004
ACM
14 years 2 months ago
2004
ACM
– A low-power graphics LSI is designed and implemented for mobile multimedia applications. The LSI contains a 32bit RISC processor with enhanced MAC, a 3D rendering engine, progr...
DAC
2011
ACM
12 years 8 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...