108 search results - page 8 / 22 » Introspective 3D chips |
MICRO
2008
IEEE
14 years 2 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
DATE
2006
IEEE
14 years 1 months ago
2006
IEEE
— The world of 3D graphics, until recently restricted to high-end workstations and game consoles, is rapidly expanding into the domain of mobile platforms such as cellular phones...
MICRO
2007
IEEE
14 years 1 months ago
2007
IEEE
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
HPCA
2009
IEEE
14 years 8 months ago
2009
IEEE
Magnetic Random Access Memory (MRAM) is considered to be a promising future memory technology due to its low leakage power, high density and fast read speed. The heterogeneous int...
ICCAD
2004
IEEE
14 years 4 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...